Jul 12, 2020 | Updated: 11:00 AM EDT

Huawei Latest News & Update: Google Jack Up Android With All New Raspberry Pi-Like Board

Apr 27, 2017 04:35 PM EDT


Huawei with Google will speed up Android on a Raspberry Pi-like board. The price has been capped at $239. It is ready to be shipped in U.S.A, Japan, and the European Union in May.

Named Hikey 960, the computer board will act as a tool to amplify software and drivers for Operating system. One can use it as a go-to PC for Android too. PCWorld reports that Linaro CEO George Grey has encouraged Android developers to construct ARM software on ARM architecture. Linaro has backed the idea and has played a pivotal role in the build-up.

Formerly, developers were compelled to write codes on x86 chips. This method was strenuous and slowed down the whole process. The computer board will house the newest GPU and CPU technologies which will enable to match the speed of latest Smartphones.

Computer World briefed the specifications and features that Hikey 960 will sport. The Huawei Kirin 960 octa-core chip powered by four cores high- performance ARM Cortex A-73 and four low-performance ARM Cortex A-53. It will house 32GB internal storage and will run on LPDDR4 Ram of 3GB. For graphics, Mali-G71 GPU will be bolstered by the latest ARM BitFrost architecture.

Multiple high-definition outputs can be used to connect cameras to the board with 40-pin and 60-pin expansion connectors. Storage can be amplified by the PCle m.2 slot present on the board. The major boost for developers would be the feasibility of creating drones and robots.

This has created a major buzz among tech geeks and developers who are willing to jump on the bandwagon. The price factor has played a key role in its popularity. However, other than the aforementioned countries and Union, the rest of the World has to wait for a tad more.

It will strengthen an already sturdy position of Huawei in Global market. Users can run Android 7.1, but they will need to enhance their technical prowess. Users can expect Linux features to be included in the future.

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